Industries

Semiconductor Localization Alliance

The Semiconductor Localization Alliance has 27 member companies. It serves makers of semiconductor equipment, materials and components, and firms from other fields moving into semiconductor applications. This page sets out member capabilities and solutions to help you find partners, with links to research on AI Infra and AI trends.

Semiconductors

Vision and strategy

The Semiconductor Localization Alliance centers on patent strategy and advanced packaging, with a focus on expanding into the US, Japan and Europe and linking to local resources there. It builds on the existing supply chain, helps firms with adjacent technologies enter semiconductor applications, and moves members toward overseas presence through market research, matchmaking and international trade shows.

Company names follow the official site, shortened by dropping legal suffixes. Members are listed by the alliance and are not endorsed by this platform.

Alliance results

24+Alliance meetings
38+Member companies
0Solutions

Supply-chain tiers and member companies

Member companies by supply-chain tier, as listed on the official site.

Upstream: IC design and IP

Chip function planning and circuit architecture, which set product performance. The official site currently lists no companies for this tier.

Midstream: process and equipment

Wafer fabrication, where process technology turns designs into working chips. Member companies (Chinese name where no official English name is published): Gudeng (家登精密工業), Greenfiltec Ltd. (濾能), Symtek Automation Asia Co., Ltd. (迅得機械), 緯凡金屬, Waste Recovery Technology Inc. (衛司特科技), Chen Full International Co., Ltd. (千附實業), iST (宜特科技), Microprogram Information Co., Ltd. (微程式資訊), Aplex Technology Inc. (維田科技), Santa Phoenix Technology Co., Ltd. (聖凰科技), Siward Crystal Technology Co., Ltd. (希華晶體科技), Chyi Ding Technologies Co., Ltd. (奇鼎科技), Feedback Technology Corp. (翔名科技), GMT Global Inc. (高明鐵企業), Yeedex Electronic Corporation (意德士科技), ASEC International Corporation (亞矽科技), 耐特科技材料, Advanced Echem Materials Company Limited (新應材), 智勝科技.

Downstream: packaging and test

Protection, electrical connection and quality verification so chips work reliably in systems. Member companies (Chinese name where no official English name is published): Asia Neo Tech Industrial Co., Ltd. (科嶠工業), SynPower Co., Ltd. (聯策科技), JKE (昆兆益精密工業), UVAT Technology Co., Ltd. (友威科技), LINCOTEC (凌嘉科技), Ableprint Technology Co., Ltd. (印能科技), 拓緯, Excel Cell Electronic Co., Ltd. (百容電子).

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