拓緯股份有限公司 (Tawei)

Designs and builds automated drying and auxiliary equipment, with custom machine development and maintenance.

Serves the PCB and semiconductor industries with machine vision, wet-process, production automation, semiconductor equipment and energy-saving solutions.

Precision sheet-metal shop offering laser cutting, bending, welding, waterjet and stamping in one line, for medical, automotive and plant equipment.

Vacuum coating and dry-etch equipment maker supplying PVD and CVD tools and coating services, used in semiconductor packaging and substrates.

Develops thin-film and plasma process equipment for advanced packaging, advanced materials and next-generation displays, and makes thermal substrates.

Supplier of packaging process equipment, including void-removal, reflow and sintering, lamination and annealing, and inspection tools.

Manufacturer of electromechanical and stamped components, including switches, relays, connectors and semiconductor lead frames.

Supplier of critical semiconductor materials and carriers, including EUV reticle pods and 300mm FOUPs.

The Semiconductor Localization Alliance has 27 member companies. It serves makers of semiconductor equipment, materials and components, and firms from other fields moving into semiconductor applications. This page sets out member capabilities and solutions to help you find partners, with links to research on AI Infra and AI trends.

A directory of research themes organized by the four alliances and by pre-investment checks. Each report will carry its version, date and sources when published.

Starting from the four alliances' strategies, we trace industry trends as they form and the partnership questions worth researching.

Anonymized R&D, production and market needs from leading companies, so startups and SMEs can judge whether to propose a solution.

TINAI's investment strategy, assessment approach, partnership resources and overseas joint promotion, as a starting point for investors.

Upcoming alliance courses and events. Dates follow the source announcements; registration may close early when seats fill.